A protection-plate-attached electronic member including: a first electronic member including a first transparent substrate; an adhesion layer which overlaps with the first transparent substrate; a protection plate fixed to the first electronic member in a state in which the adhesion layer intervenes between the protection plate and the first transparent substrate; and a peeling auxiliary section which intervenes between the adhesion layer and one of the protection plate and the first electronic member so as to lower bonding strength between the adhesion layer and the one of the protection plate and the first electronic member, wherein the adhesion layer includes an overlapping section which overlaps with the peeling auxiliary section; and a nonoverlapping section which does not overlap with the peeling auxiliary section and which directly contacts with the one of the protection plate and the first electronic member.