Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12888615Application Date: 2010-09-23
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Publication No.: US08411460B2Publication Date: 2013-04-02
- Inventor: Guang-Feng Ou , Yong-Zhao Huang
- Applicant: Guang-Feng Ou , Yong-Zhao Huang
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010263935 20100826
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H05K1/14
Abstract:
A printed circuit board includes a power layer, a ground layer, a signal layer, and a backboard. The backboard is arranged below the signal layer opposite to the ground layer. A number of vias are formed from the backboard through the signal layer, and then connected to the ground layer.
Public/Granted literature
- US20120048601A1 PRINTED CIRCUIT BOARD Public/Granted day:2012-03-01
Information query
