发明授权
- 专利标题： Multilayer circuit substrate
- 专利标题（中）： 多层电路基板
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申请号： US12585293申请日： 2009-09-10
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公开(公告)号： US08415565B2公开(公告)日： 2013-04-09
- 发明人: Shigeki Nagase , Motoo Nakai , Kouya Yoshida , Hiroshi Sumasu , Nobuhiro Uchida
- 申请人： Shigeki Nagase , Motoo Nakai , Kouya Yoshida , Hiroshi Sumasu , Nobuhiro Uchida
- 申请人地址： JP Osaka
- 专利权人： JTEKT Corporation
- 当前专利权人： JTEKT Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Oliff & Berridge, PLC
- 优先权： JP2008-237471 20080917
- 主分类号： H05K1/00
- IPC分类号： H05K1/00
摘要：
A multilayer circuit substrate includes: a laminated circuit portion in which conductive layers and resin insulating layers are alternately laminated; and a metal substrate portion, wherein the laminated circuit portion is fixed to the metal substrate portion so that at least part of a lower surface of the laminated circuit portion is in contact with at least part of an upper surface of the metal substrate portion. An electronic component is mounted on the metal substrate portion.
公开/授权文献
- US20100065307A1 Multilayer circuit substrate 公开/授权日：2010-03-18
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