发明授权
US08415804B2 Semiconductor chip, method of fabricating the same, and stack module and memory card including the same
有权
半导体芯片及其制造方法，以及包括其的堆叠模块和存储卡
- 专利标题： Semiconductor chip, method of fabricating the same, and stack module and memory card including the same
- 专利标题（中）： 半导体芯片及其制造方法，以及包括其的堆叠模块和存储卡
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申请号： US12639241申请日： 2009-12-16
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公开(公告)号： US08415804B2公开(公告)日： 2013-04-09
- 发明人: Ho-jin Lee , Dong-hyun Jang , In-young Lee , Min-seung Yoon , Son-kwan Hwang
- 申请人： Ho-jin Lee , Dong-hyun Jang , In-young Lee , Min-seung Yoon , Son-kwan Hwang
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG Electronics Co., Ltd.
- 当前专利权人： SAMSUNG Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Stanzione & Kim, LLP
- 优先权： KR10-2009-0058315 20090629
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/44
摘要：
A semiconductor chip, a method of fabricating the same, and a stack module and a memory card including the semiconductor chip include a first surface and a second surface facing the first surface is provided. At least one via hole including a first portion extending in a direction from the first surface of the substrate to the second surface of the substrate and a second portion that is connected to the first portion and has a tapered shape. At least one via electrode filling the at least one via hole is provided.