- 专利标题： Identification of dies on a semiconductor wafer
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申请号： US13160885申请日： 2011-06-15
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公开(公告)号： US08415813B2公开(公告)日： 2013-04-09
- 发明人: Shen Wang , Robert P. Fabinski , James E. Doran , Laurel J. Pace , Eric J. Meisenzahl
- 申请人： Shen Wang , Robert P. Fabinski , James E. Doran , Laurel J. Pace , Eric J. Meisenzahl
- 申请人地址： US NY Rochester
- 专利权人： Truesense Imaging, Inc.
- 当前专利权人： Truesense Imaging, Inc.
- 当前专利权人地址： US NY Rochester
- 代理机构： Howard & Howard Attorneys PLLC
- 主分类号： H01L21/66
- IPC分类号： H01L21/66
摘要：
A semiconductor wafer includes multiple dies and a die identification region adjacent to or on each die. The die identification region can include a wafer indicator and a pattern of die locations representing die locations on the wafer. A die identification marker is provided in each pattern of die locations in the die identification region specifying a location of a respective die on the wafer.
公开/授权文献
- US20120319307A1 IDENTIFICATION OF DIES ON A SEMICONDUCTOR WAFER 公开/授权日：2012-12-20
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