Invention Grant
- Patent Title: Piezoelectric vibrator, piezoelectric vibrator mounting body, and piezoelectric vibrator manufacturing method
- Patent Title (中): 压电振动器,压电振动器安装体和压电振子的制造方法
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Application No.: US13196356Application Date: 2011-08-02
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Publication No.: US08415862B2Publication Date: 2013-04-09
- Inventor: Takeshi Sugiyama
- Applicant: Takeshi Sugiyama
- Applicant Address: JP Chiba
- Assignee: Seiko Instruments Inc.
- Current Assignee: Seiko Instruments Inc.
- Current Assignee Address: JP Chiba
- Agency: Brinks Hofer Gilson & Lione
- Main IPC: H01L41/08
- IPC: H01L41/08

Abstract:
This piezoelectric vibrator is provided with a package that is structured to include a first substrate and a second substrate that are bonded to each other such that a cavity is formed therebetween, an internal electrode portion that is formed on the first substrate and housed in the cavity, a piezoelectric vibrating reed that is sealed in the cavity and also is electrically connected to the internal electrode portion in the cavity, an external electrode portion that is formed on an external surface of the first substrate, a through electrode portion that is disposed so as not to be overlapped by the external electrode portion in a thickness direction of the first substrate, while one end of the through electrode portion is electrically connected to the internal electrode portion and another end of the through electrode portion is formed on the external surface of the first substrate while penetrating through the first substrate, and a routing wiring portion that electrically connects the through electrode portion and the external electrode portion.
Public/Granted literature
Information query
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