A method and circuit for implementing multiple active paths between source and destination devices in an interconnect system while removing ghost packets, and a design structure on which the subject circuit resides are provided. Each packet includes a generation ID and is assigned an End-to-End (ETE) sequence number in the source interconnect chip that represents the packet position in an ordered packet stream from the source device. The packets are transmitted from a source interconnect chip source to a destination interconnect chip on the multiple active paths. The generation ID of a received packet is compared with a current generation ID at a destination interconnect chip to validate packet acceptance. The destination interconnect chip uses the ETE sequence numbers to reorder the accepted received packets into the correct order before sending the packets to the destination device.