发明授权
- 专利标题： Light emitting device and method of manufacturing the same
- 专利标题（中）： 发光元件及其制造方法
-
申请号： US12923949申请日： 2010-10-15
-
公开(公告)号： US08419497B2公开(公告)日： 2013-04-16
- 发明人: Isao Takasu , Yuko Nomura , Tsuyoshi Hioki , Isao Amemiya , Kazuhide Abe
- 申请人： Isao Takasu , Yuko Nomura , Tsuyoshi Hioki , Isao Amemiya , Kazuhide Abe
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 优先权： JPP2007-132552 20070518
- 主分类号： H01J9/00
- IPC分类号： H01J9/00
摘要：
A method of manufacturing a light emitting device. The method includes: mounting a light emitting chip on a substrate; forming a transparent resin portion and a phosphor layer by using a liquid droplet discharging apparatus, the transparent resin portion being formed in a shape of a dome and covering the light emitting chip to fill an exterior thereof on the substrate, a phosphor layer containing phosphor and being formed on an exterior of the transparent resin portion close to at least a top side thereof; and forming a reflecting layer at a position exterior of the transparent resin portion and the phosphor layer close to the substrate.
公开/授权文献
信息查询
