发明授权
US08421222B2 Chip package having a chip combined with a substrate via a copper pillar
有权
具有通过铜柱与基板结合的芯片的芯片封装
- 专利标题： Chip package having a chip combined with a substrate via a copper pillar
- 专利标题（中）： 具有通过铜柱与基板结合的芯片的芯片封装
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申请号： US13207350申请日： 2011-08-10
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公开(公告)号： US08421222B2公开(公告)日： 2013-04-16
- 发明人: Mou-Shiung Lin , Shih-Hsiung Lin, I
- 申请人： Mou-Shiung Lin , Shih-Hsiung Lin, I
- 申请人地址： TW Hsinchu
- 专利权人： Megica Corporation
- 当前专利权人： Megica Corporation
- 当前专利权人地址： TW Hsinchu
- 代理机构： Seyfarth Shaw LLP
- 优先权： TW91125126A 20021025
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L21/00
摘要：
A method of assembling chips. A first chip and a second chip are provided. At least one conductive pillar is formed on the first chip, and a conductive connecting material is formed on the conductive pillar. The second chip also comprises at least one conductive pillar. The first chip is connected to the second chip via the conductive pillars and the conductive connecting material.
公开/授权文献
- US20110291275A1 METHOD OF ASSEMBLING CHIPS 公开/授权日：2011-12-01