Invention Grant
- Patent Title: Semiconductor device with heat spreaders
- Patent Title (中): 带散热器的半导体器件
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Application No.: US13173347Application Date: 2011-06-30
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Publication No.: US08421235B2Publication Date: 2013-04-16
- Inventor: Shigeo Ide , Akihiro Niimi
- Applicant: Shigeo Ide , Akihiro Niimi
- Applicant Address: JP Kariya
- Assignee: Denso Corporation
- Current Assignee: Denso Corporation
- Current Assignee Address: JP Kariya
- Agency: Nixon & Vanderhye PC
- Priority: JP2010-149671 20100630; JP2011-054368 20110311
- Main IPC: H01L23/473
- IPC: H01L23/473 ; H01L25/10 ; H01L23/48 ; H01L25/07
Abstract:
The semiconductor device has a unit stack body including a plurality of units stacked on one another. Each unit includes a power terminal constituted of a lead part and a connection part. The connection part is formed with a projection and a recess. When the units are stacked on one another, the projection of one unit is fitted to the recess of the adjacent unit, so that the power terminals of the respective unit are connected to one another.
Public/Granted literature
- US20120001341A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-01-05
Information query
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