Invention Grant
- Patent Title: TFT substrate and method of manufacturing the same
- Patent Title (中): TFT基板及其制造方法
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Application No.: US12831658Application Date: 2010-07-07
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Publication No.: US08421941B2Publication Date: 2013-04-16
- Inventor: Kumi Tsuda , Kazunori Inoue , Masaru Aoki
- Applicant: Kumi Tsuda , Kazunori Inoue , Masaru Aoki
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2009-171984 20090723
- Main IPC: G02F1/136
- IPC: G02F1/136

Abstract:
There is provided a TFT substrate including a gate electrode having a thick film part and a thin film part with a smaller film thickness than the thick film part, a semiconductor active film formed above the thick film part and the thin film part of the gate electrode, an ohmic contact film formed on an inside of the semiconductor active film and on the semiconductor active film corresponding to the thin film part on an outside of the thick film part, and an electrode film constituting a source electrode and a drain electrode, having a planar shape identical to or on an inside of the ohmic contact film, and formed on the ohmic contact film.
Public/Granted literature
- US20110017993A1 TFT SUBSTRATE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-01-27
Information query
IPC分类: