发明授权
- 专利标题： Temperature detection method of semiconductor device and power conversion apparatus
- 专利标题（中）： 半导体器件和功率转换装置的温度检测方法
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申请号： US11036012申请日： 2005-01-18
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公开(公告)号： US08423317B2公开(公告)日： 2013-04-16
- 发明人: Tomoya Kamezawa , Naoki Takata , Masayuki Hirota , Masahiro Hiraga , Satoshi Ibori
- 申请人： Tomoya Kamezawa , Naoki Takata , Masayuki Hirota , Masahiro Hiraga , Satoshi Ibori
- 申请人地址： JP Chiba
- 专利权人： Hitachi Industrial Equipment Systems Co., Ltd.
- 当前专利权人： Hitachi Industrial Equipment Systems Co., Ltd.
- 当前专利权人地址： JP Chiba
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2004-062568 20040305; JP2004-222738 20040730
- 主分类号： G01K11/00
- IPC分类号： G01K11/00
摘要：
A temperature detection method for a semiconductor device and a power conversion apparatus are disclosed. A temperature detection device is used to detect the temperature for thermal protection of a power semiconductor device. The temperature detection device is placed in the proximity of a component having the power semiconductor device packaged therein, and either an emitter terminal or a collector terminal of the power semiconductor device. Since the temperature detection device is mounted on a circuit board, it does not require insulation from a cooling fin on which the power semiconductor device is mounted and lead wires can be eliminated.
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