发明授权
US08430484B2 Nozzle covering for ejection chips in micro-fluid applications 有权
用于微流体应用中喷射芯片的喷嘴盖

  • 专利标题: Nozzle covering for ejection chips in micro-fluid applications
  • 专利标题(中): 用于微流体应用中喷射芯片的喷嘴盖
  • 申请号: US12824358
    申请日: 2010-06-28
  • 公开(公告)号: US08430484B2
    公开(公告)日: 2013-04-30
  • 发明人: Jiandong Fang
  • 申请人: Jiandong Fang
  • 申请人地址: US KY Lexington
  • 专利权人: Lexmark International, Inc.
  • 当前专利权人: Lexmark International, Inc.
  • 当前专利权人地址: US KY Lexington
  • 主分类号: B41J2/05
  • IPC分类号: B41J2/05
Nozzle covering for ejection chips in micro-fluid applications
摘要:
A micro-fluid ejection head conveys fluid to firing elements at differing heights in differing layers. The ejection head includes a base substrate. The firing elements are configured on the substrate to eject fluid upon activation. Individual elements are arrayed closer or farther to a common fluid via. A multiple-layer covering on the substrate defines nozzles openings corresponding to each firing element. A lower layer of the covering directs fluid to either the closer or farther elements while a higher layer directs fluid to the other elements. The lower and higher layers define channels to direct the fluid from the fluid via. The higher layer covers the channels in the lower layer, while a topmost layer covers the channels in the higher layer. Also, the topmost layer defines the nozzle openings in large and small opening sizes. Holes in the underlying layers register with the nozzle openings, but are oppositely sized.
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