Invention Grant
- Patent Title: Interposer and electronic device
- Patent Title (中): 内插和电子设备
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Application No.: US12884701Application Date: 2010-09-17
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Publication No.: US08431830B2Publication Date: 2013-04-30
- Inventor: Akira Tamura
- Applicant: Akira Tamura
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Squire, Sanders (US) LLP
- Priority: JP2009-223178 20090928
- Main IPC: H05K1/03
- IPC: H05K1/03
Abstract:
An interposer for connecting a semiconductor and a circuit board includes an insulating material sheet, a through hole which is formed in the insulating material sheet and an elastic conductive contact which is formed from an elastic conductive sheet and provided in the through hole.
Public/Granted literature
- US20110073355A1 INTERPOSER AND ELECTRONIC DEVICE Public/Granted day:2011-03-31
Information query
