发明授权
- 专利标题: Transparent conductor structure
- 专利标题(中): 透明导体结构
-
申请号: US12626489申请日: 2009-11-25
-
公开(公告)号: US08432598B2公开(公告)日: 2013-04-30
- 发明人: Jong-Souk Yeo , Gregg Alan Combs , Tim R. Koch
- 申请人: Jong-Souk Yeo , Gregg Alan Combs , Tim R. Koch
- 申请人地址: US TX Houston
- 专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人: Hewlett-Packard Development Company, L.P.
- 当前专利权人地址: US TX Houston
- 主分类号: G02B26/00
- IPC分类号: G02B26/00 ; G03G17/04 ; G09G3/34
摘要:
A transparent conductor structure includes a transparent, insulating substrate and a discontinuous, transparent conducting layer established on the substrate. The discontinuous conducting layer is partitioned into a plurality of segments, each of which has a thickness ranging from about 1 nm to about 10 μm. Two or more of the segments are connected together by i) a metal trace disposed on or between them, or ii) a mesh, formed from a plurality of metal traces, disposed across a surface of the segments.
公开/授权文献
- US20110120749A1 TRANSPARENT CONDUCTOR STRUCTURE 公开/授权日:2011-05-26
信息查询