Invention Grant
- Patent Title: Transparent conductor structure
- Patent Title (中): 透明导体结构
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Application No.: US12626489Application Date: 2009-11-25
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Publication No.: US08432598B2Publication Date: 2013-04-30
- Inventor: Jong-Souk Yeo , Gregg Alan Combs , Tim R. Koch
- Applicant: Jong-Souk Yeo , Gregg Alan Combs , Tim R. Koch
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: G02B26/00
- IPC: G02B26/00 ; G03G17/04 ; G09G3/34

Abstract:
A transparent conductor structure includes a transparent, insulating substrate and a discontinuous, transparent conducting layer established on the substrate. The discontinuous conducting layer is partitioned into a plurality of segments, each of which has a thickness ranging from about 1 nm to about 10 μm. Two or more of the segments are connected together by i) a metal trace disposed on or between them, or ii) a mesh, formed from a plurality of metal traces, disposed across a surface of the segments.
Public/Granted literature
- US20110120749A1 TRANSPARENT CONDUCTOR STRUCTURE Public/Granted day:2011-05-26
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