Invention Grant
- Patent Title: ESD protection device
- Patent Title (中): ESD保护装置
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Application No.: US13153589Application Date: 2011-06-06
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Publication No.: US08432653B2Publication Date: 2013-04-30
- Inventor: Jun Adachi , Jun Urakawa , Takahiro Sumi , Takahiro Kitadume
- Applicant: Jun Adachi , Jun Urakawa , Takahiro Sumi , Takahiro Kitadume
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-314705 20081210
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H02H9/00 ; H02H7/20 ; H02H1/00
Abstract:
An ESD protection device includes a ceramic multilayer substrate, at least one pair of discharge electrodes provided in the ceramic multilayer substrate and facing each other with a space formed therebetween, external electrodes provided on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode obtained by dispersing a metal material and a semiconductor material and being arranged in a region that connects the pair of discharge electrodes to each other.
Public/Granted literature
- US20110227196A1 ESD PROTECTION DEVICE Public/Granted day:2011-09-22
Information query
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