An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The printed circuit board is secured on a casing of an electronic system. The heat dissipation device includes a heat sink disposed on the electronic component; and a plurality of fasteners extending through the heat sink, respectively, to assemble the heat sink to the printed circuit board. Each of the fasteners includes a supporting member fixed in the printed circuit board, an engaging member fixed in the board, and a screwing post engaging with the heat sink. A bottom portion of the screwing post extends through the printed circuit board via the supporting member, and is screwed into the engaging member.