发明授权
- 专利标题： Device and method for wet treating disc-like substrates
- 专利标题（中）： 用于湿处理盘状基底的装置和方法
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申请号： US13415229申请日： 2012-03-08
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公开(公告)号： US08435356B2公开(公告)日： 2013-05-07
- 发明人: Rainer Obweger , Alexander Pfeuffer , Martin Köffler , Alexander Lippert
- 申请人： Rainer Obweger , Alexander Pfeuffer , Martin Köffler , Alexander Lippert
- 申请人地址： AT Villach
- 专利权人： Lam Research AG
- 当前专利权人： Lam Research AG
- 当前专利权人地址： AT Villach
- 代理机构： Young & Thompson
- 优先权： ATA970/2003 20030624
- 主分类号： B08B3/12
- IPC分类号： B08B3/12
摘要：
A method for wet treatment of wafers includes a first plate and a second plate substantially parallel to the first plate, and a wafer is held between the first and the second plate substantially parallel. A first dispenser introduces fluid into a first gap between the first plate and the wafer when being treated, and a second dispenser introduces fluid into a second gap between the second plate and the wafer when being treated. At least one vibrating element is acoustically coupled to at least the second plate, and a holder and the second plate are rotated relative to each other about an axis substantially perpendicular to the second plate.
公开/授权文献
- US20120167914A1 DEVICE AND METHOD FOR WET TREATING DISC-LIKE SUBSTRATES 公开/授权日：2012-07-05
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