发明授权
- 专利标题： Metal-passivating CMP compositions and methods
- 专利标题（中）： 金属钝化CMP组合物和方法
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申请号： US13004113申请日： 2011-01-11
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公开(公告)号： US08435421B2公开(公告)日： 2013-05-07
- 发明人: Jason Keleher , Pankaj Singh , Vlasta Brusic
- 申请人： Jason Keleher , Pankaj Singh , Vlasta Brusic
- 申请人地址： US IL Aurora
- 专利权人： Cabot Microelectronics Corporation
- 当前专利权人： Cabot Microelectronics Corporation
- 当前专利权人地址： US IL Aurora
- 代理商 Thomas E Omholt; Steven D Weseman
- 主分类号： B44C1/22
- IPC分类号： B44C1/22 ; C03C15/00 ; C03C25/68 ; C23F1/00
摘要：
The present invention provides chemical-mechanical polishing (CMP) compositions and methods for polishing copper- and/or silver-containing substrates. The compositions of the present invention comprise a particulate abrasive, a primary film-forming metal-complexing agent, and a secondary film-forming metal-passivating agent in an aqueous carrier. Methods of polishing a substrate with the compositions of the invention are also disclosed.
公开/授权文献
- US20110100956A1 METAL-PASSIVATING CMP COMPOSITIONS AND METHODS 公开/授权日：2011-05-05
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