Invention Grant
- Patent Title: MEMS capacitive microphone
- Patent Title (中): MEMS电容麦克风
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Application No.: US12844436Application Date: 2010-07-27
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Publication No.: US08436435B2Publication Date: 2013-05-07
- Inventor: Chun-Kai Chan , Weileun Fang
- Applicant: Chun-Kai Chan , Weileun Fang
- Applicant Address: TW Hsinchu
- Assignee: National Tsing Hua University
- Current Assignee: National Tsing Hua University
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Main IPC: H01L29/84
- IPC: H01L29/84
Abstract:
The present invention discloses an MEMS capacitive microphone including a rigid diaphragm arranged on an elastic element. When a sound wave acts on the rigid diaphragm, the rigid diaphragm is moved parallel to a normal of a back plate by elasticity of the elastic element. Thereby the variation of the capacitance is obtained between the rigid diaphragm and the back plate.
Public/Granted literature
- US20120025334A1 MEMS CAPACITIVE MICROPHONE Public/Granted day:2012-02-02
Information query
IPC分类:
