Invention Grant
- Patent Title: Methods of fluxless micro-piercing of solder balls, and resulting devices
- Patent Title (中): 无焊剂微球穿刺的方法及其结果
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Application No.: US12827476Application Date: 2010-06-30
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Publication No.: US08436478B2Publication Date: 2013-05-07
- Inventor: Teck Kheng Lee
- Applicant: Teck Kheng Lee
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48 ; H01L29/40
Abstract:
A method is disclosed which includes forming a layer of conductive material above a substrate, forming a masking layer above the layer of conductive material, performing a first etching process on the layer of conductive material with the masking layer in place, removing the masking layer and, after removing the masking layer, performing an isotropic etching process on the layer of conductive material to thereby define a plurality of piercing bond structures positioned on the substrate.
Public/Granted literature
- US20100264541A1 METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING DEVICES Public/Granted day:2010-10-21
Information query
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