A power clamping circuit with temperature compensation is disclosed. The power clamping circuit, for a system voltage, includes a first diode, a resistor with a positive temperature coefficient, a second diode, a comparator including a negative input terminal coupled to an anode of the first diode and a positive input terminal coupled to the resistor with the positive temperature coefficient, a transistor including a gate coupled to an output terminal of the comparator, a drain coupled to the system voltage and a source coupled to the ground, a first resistor, a second resistor, a third resistor, a fourth resistor, and a fifth resistor.