An assembly for mounting electronic components includes a face plate comprising a thermoplastic material. The face plate includes a retaining element for securing a captive screw and spring assembly for mounting an electronic printed circuit board. The retaining element includes one or more slots adapted to expand the element to permit insertion of the screw and deformation of the hole upon insertion of the screw, while locking the screw to retain the screw in place. This arrangement permits the elimination of the metal standoff frequently used in similar devices. Methods for preparing the assembly and mounting the printed circuit boards are also described.