Invention Grant
- Patent Title: Method for manufacturing a pattern formed body, method for manufacturing a functional element, and method for manufacturing a semiconductor element
- Patent Title (中): 图案形成体的制造方法，功能元件的制造方法以及半导体元件的制造方法
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Application No.: US13071715Application Date: 2011-03-25
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Publication No.: US08440518B2Publication Date: 2013-05-14
- Inventor: Kenichi Ogawa , Tomomi Suzuki , Masataka Kano
- Applicant: Kenichi Ogawa , Tomomi Suzuki , Masataka Kano
- Applicant Address: JP Tokyo-to
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo-to
- Agency: Ladas & Parry LLP
- Priority: JP2010-082957 20100331
- Main IPC: H01L21/336
- IPC: H01L21/336
Abstract:
A manufacturing method of a semiconductor element from a pattern formed body capable of attaining patterning efficiently with a high precision. The method includes a photoresist pattern formation step, a hydrophilicity imparting step and a photoresist pattern peeling step.
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