Invention Grant
- Patent Title: Electronic circuit composed of sub-circuits and method for producing
- Patent Title (中): 电子电路由子电路及其制造方法组成
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Application No.: US12733929Application Date: 2008-09-03
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Publication No.: US08441114B2Publication Date: 2013-05-14
- Inventor: Martin Birner , Rainer Kreutzer , Hubert Schierling , Norbert Seliger
- Applicant: Martin Birner , Rainer Kreutzer , Hubert Schierling , Norbert Seliger
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Agency: Staas & Halsey LLP
- Priority: DE102007046969 20070928
- International Application: PCT/EP2008/061599 WO 20080903
- International Announcement: WO2009/043670 WO 20090409
- Main IPC: H01L23/22
- IPC: H01L23/22
Abstract:
To improve manufacture of an electronic circuit, the electronic circuit is composed of modules of sub-circuits arranged on a common substrate, such as a cooling body, and that are electrically interconnected by a planar electrical contact element.
Public/Granted literature
- US20100309633A1 ELECTRONIC CIRCUIT COMPOSED OF SUB-CIRCUITS AND METHOD FOR PRODUCING THE SAME Public/Granted day:2010-12-09
Information query
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