Invention Grant
- Patent Title: Cu pillar bump with non-metal sidewall protection structure
- Patent Title (中): 铜柱凸起与非金属侧壁保护结构
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Application No.: US12769768Application Date: 2010-04-29
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Publication No.: US08441124B2Publication Date: 2013-05-14
- Inventor: Yi-Wen Wu , Cheng-Chung Lin , Chien Ling Hwang , Chung-Shi Liu
- Applicant: Yi-Wen Wu , Cheng-Chung Lin , Chien Ling Hwang , Chung-Shi Liu
- Applicant Address: TW
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW
- Agency: Lowe, Hauptman, Ham & Berner, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52
Abstract:
A sidewall protection structure is provided for covering at least a portion of a sidewall surface of a bump structure, in which a protection structure on the sidewalls of a Cu pillar and a surface region of an under-bump-metallurgy (UBM) layer is formed of at least one non-metal material layers, for example a dielectric material layer, a polymer material layer, or combinations thereof.
Public/Granted literature
- US20110266667A1 CU PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE Public/Granted day:2011-11-03
Information query
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