发明授权
- 专利标题： Printed circuit board
- 专利标题（中）： 印刷电路板
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申请号： US12960321申请日： 2010-12-03
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公开(公告)号： US08441327B2公开(公告)日： 2013-05-14
- 发明人: Hua-Li Zhou , Ming Wei , Chia-Nan Pai , Shou-Kuo Hsu
- 申请人： Hua-Li Zhou , Ming Wei , Chia-Nan Pai , Shou-Kuo Hsu
- 申请人地址： CN Shenzhen TW New Taipei
- 专利权人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址： CN Shenzhen TW New Taipei
- 代理机构： Altis Law Group, Inc.
- 优先权： CN201010223746 20100712
- 主分类号： H03H7/38
- IPC分类号： H03H7/38
摘要：
A printed circuit board includes an insulation layer and a signal layer attached to the insulation layer. The signal layer includes a pair of differential transmission lines. Width W of each of the differential transmission lines is changed according to change of space S between the differential transmission lines, based on the following formula: W = C 1 × H × ( C 2 × H 0.8 W 0 + T ) C 3 × ⅇ C 4 × S 0 H - 1 1 - C 3 × ⅇ C 4 × S H - 1.25 T In above formula, C1=7.475, C2=5.98, C3=0.48, C4=−0.96, H is a thickness of the insulation layer, W0 is an original width of each of the differential transmission lines, and S0 is an original space between the differential transmission lines, and T is a thickness of each of the differential transmission lines.
公开/授权文献
- US20120007688A1 PRINTED CIRCUIT BOARD 公开/授权日：2012-01-12
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