Invention Grant
- Patent Title: Electronic paper unit and method for fabricating electronic paper unit
- Patent Title (中): 电子纸单元及其制造方法
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Application No.: US13310814Application Date: 2011-12-05
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Publication No.: US08441715B2Publication Date: 2013-05-14
- Inventor: Chan-Wei Chang , Ho-Chien Wu , Chia-Tien Peng , Chih-Jen Hu
- Applicant: Chan-Wei Chang , Ho-Chien Wu , Chia-Tien Peng , Chih-Jen Hu
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW99144527A 20101217; TW100132136A 20110906
- Main IPC: G02B26/00
- IPC: G02B26/00 ; B60R1/06 ; H01J9/26

Abstract:
An electronic paper unit including a flexible substrate, a thin film transistor layer, an electronic ink layer, a waterproof layer, and a sealant is provided. The thin film transistor layer is disposed on the flexible substrate. The electronic ink layer is disposed on a surface of the thin film transistor layer. The waterproof layer is disposed on the electronic ink layer. An edge surface of the waterproof layer and an edge surface of the electronic ink layer form a side wall where there is a first acute angle or a first obtuse angle between the side wall and the surface of the thin film transistor layer. The sealant is coated and covered on the side wall and the surface. A method for fabricating the electronic paper unit is also provided.
Public/Granted literature
- US20120154897A1 ELECTRONIC PAPER UNIT AND METHOD FOR FABRICATING ELECTRONIC PAPER UNIT Public/Granted day:2012-06-21
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