Invention Grant
- Patent Title: Conformal deposition of dielectric composites by eletrophoresis
- Patent Title (中): 通过电泳对介电复合材料进行保形沉积
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Application No.: US12638224Application Date: 2009-12-15
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Publication No.: US08441775B2Publication Date: 2013-05-14
- Inventor: Seth Adrian Miller
- Applicant: Seth Adrian Miller
- Applicant Address: US DE Wilmington
- Assignee: Empire Technology Development, LLC
- Current Assignee: Empire Technology Development, LLC
- Current Assignee Address: US DE Wilmington
- Agency: Moritt Hock & Hamroff LLP
- Agent Steven S. Rubin, Esq.
- Main IPC: H01G9/00
- IPC: H01G9/00 ; H01G4/06

Abstract:
Techniques are generally described herein for the design, manufacture and use of composite dielectric materials. Embodiments include, but are not limited to, methods, apparatuses, and systems. Other embodiments may also be disclosed and claimed. Some techniques described herein include electrophoretic deposition of dielectric particles to conformally form a thin layer of dielectric material for use in energy storage devices. Example energy storage devices include capacitor devices, which in some instances may be used to replace and/or assist in the operation of batteries, ultra-capacitors, and other similar devices.
Public/Granted literature
- US20110140525A1 CONFORMAL DEPOSITION OF DIELECTRIC COMPOSITES BY ELECTROPHORESIS Public/Granted day:2011-06-16
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