- 专利标题： LED package having an array of light emitting cells coupled in series
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申请号： US12782287申请日： 2010-05-18
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公开(公告)号： US08445933B2公开(公告)日： 2013-05-21
- 发明人: Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
- 申请人： Chung Hoon Lee , Keon Young Lee , Hong San Kim , Dae Won Kim , Hyuck Jung Choi
- 申请人地址： KR Seoul
- 专利权人： Seoul Semiconductor Co., Ltd.
- 当前专利权人： Seoul Semiconductor Co., Ltd.
- 当前专利权人地址： KR Seoul
- 代理机构： H.C. Park & Associates, PLC
- 优先权： KR10-2005-0020377 20050311; KR10-2005-0026067 20050329; KR10-2005-0026078 20050329; KR10-2005-0026090 20050329; KR10-2005-0026108 20050329
- 主分类号： H01L33/62
- IPC分类号： H01L33/62
摘要：
Disclosed is a light emitting diode (LED) package having an array of light emitting cells coupled in series. The LED package comprises a package body and an LED chip mounted on the package body. The LED chip has an array of light emitting cells coupled in series. Since the LED chip having the array of light emitting cells coupled in series is mounted on the LED package, it can be driven directly using an AC power source.