Invention Grant
- Patent Title: Multi-chip module
- Patent Title (中): 多芯片模块
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Application No.: US12902527Application Date: 2010-10-12
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Publication No.: US08446020B2Publication Date: 2013-05-21
- Inventor: Masateru Koide , Daisuke Mizutani , Aiichiro Inoue , Hideo Yamashita , Iwao Yamazaki , Masayuki Kato , Seiji Ueno , Kazuyuki Imamura
- Applicant: Masateru Koide , Daisuke Mizutani , Aiichiro Inoue , Hideo Yamashita , Iwao Yamazaki , Masayuki Kato , Seiji Ueno , Kazuyuki Imamura
- Applicant Address: JP Kawasaki JP Yokohama
- Assignee: Fujitsu Limited,Fujitsu Semiconductor Limited
- Current Assignee: Fujitsu Limited,Fujitsu Semiconductor Limited
- Current Assignee Address: JP Kawasaki JP Yokohama
- Agency: Squire Sanders (US) LLP
- Priority: JP2009-239489 20091016
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
A multi-chip module includes: a board; a wiring board disposed on the board and including a wiring pattern; and a plurality of chips disposed on the wiring board. Each of the plurality of chips is connected with at least one of the other chips, and the plurality of chips and the board are electrically connected with each other via a portion other than the wiring pattern of the wiring board.
Public/Granted literature
- US20110089579A1 MULTI-CHIP MODULE Public/Granted day:2011-04-21
Information query
IPC分类:
