Invention Grant
- Patent Title: Circuit device and electronic device
- Patent Title (中): 电路设备和电子设备
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Application No.: US12641934Application Date: 2009-12-18
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Publication No.: US08446739B2Publication Date: 2013-05-21
- Inventor: Masato Harikae
- Applicant: Masato Harikae
- Applicant Address: JP Kyoto
- Assignee: KYOCERA Corporation
- Current Assignee: KYOCERA Corporation
- Current Assignee Address: JP Kyoto
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Priority: JP2008-327979 20081224
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K1/16
Abstract:
An electronic circuit device comprising an attaching material between an electronic component and a circuit board is disclosed. A bonding resin is situated on a side of an electronic component and flowed between the electronic component and a circuit board. The flow action may be facilitated by thermoplasticity and capillary action.
Public/Granted literature
- US20100155125A1 Circuit Device and Electronic Device Public/Granted day:2010-06-24
Information query
