A heat dissipation assembly includes a fixing board defining a fixing groove, a heat sink device fixed to the fixing board, a fan housing assembly fixed to the heat sink device, and a heat dissipation pipe. The heat sink device defines a first receiving groove aligning with the fixing groove, and a second receiving groove opposite to the first receiving groove. The fan housing assembly includes a frame defining a slot aligning with the second receiving groove, and a fan received in the frame. The dissipation pipe includes a first pipe portion, a second pipe portion, and an arc-shaped connecting portion connecting the first and second pipe portions. The first pipe portion is accommodated in the fixing groove and the first receiving groove. The second pipe portion is accommodated in the second receiving groove and the slot.