发明授权
- 专利标题： Liquid solvent abutment unit
- 专利标题（中）： 液体溶剂邻接单元
-
申请号： US12448916申请日： 2008-01-11
-
公开(公告)号： US08449691B2公开(公告)日： 2013-05-28
- 发明人: Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
- 申请人： Akihiko Nakamura , Atsushi Miyanari , Yoshihiro Inao , Yasumasa Iwata
- 申请人地址： JP Kanagawa
- 专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人： Tokyo Ohka Kogyo Co., Ltd.
- 当前专利权人地址： JP Kanagawa
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 优先权： JP2007-010335 20070119
- 国际申请： PCT/JP2008/000017 WO 20080111
- 国际公布： WO2008/087855 WO 20080724
- 主分类号： B08B3/00
- IPC分类号： B08B3/00
摘要：
In order to provide a liquid solvent abutment unit for accelerating the reaction of a liquid solvent against an adhesive member existing between a perforated support plate and a wafer, a liquid solvent abutment unit includes a supply part for supplying a support plate surface with a liquid solvent, a retention part for retaining the supplied liquid solvent in the hole-formed region on the support plate surface; a recovery part for recovering the liquid solvent retained in the hole-formed region, and a vibration unit for vibrating the liquid solvent.
公开/授权文献
- US20100024853A1 LIQUID SOLVENT ABUTMENT UNIT 公开/授权日：2010-02-04