发明授权
US08449809B2 Polymer powder comprising polyamide use thereof in a moulding method and moulded body made from said polymer powder
有权
包含聚酰胺用途的聚合物粉末的成型方法和由所述聚合物粉末制成的成型体
- 专利标题： Polymer powder comprising polyamide use thereof in a moulding method and moulded body made from said polymer powder
- 专利标题（中）： 包含聚酰胺用途的聚合物粉末的成型方法和由所述聚合物粉末制成的成型体
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申请号： US13281000申请日： 2011-10-25
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公开(公告)号： US08449809B2公开(公告)日： 2013-05-28
- 发明人: Sylvia Monsheimer , Franz-Erich Baumann , Maik Grebe , Joerg Lohmar
- 申请人： Sylvia Monsheimer , Franz-Erich Baumann , Maik Grebe , Joerg Lohmar
- 申请人地址： DE Essen
- 专利权人： Evonik Degussa GmbH
- 当前专利权人： Evonik Degussa GmbH
- 当前专利权人地址： DE Essen
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： DE102004020453 20040427
- 主分类号： H05B6/00
- IPC分类号： H05B6/00
摘要：
A molding, produced by a layer-by-layer process in which regions of respective polymer pulverulent layers are selectively melted via introduction of electromagnetic energy, where the process employs a powder which comprises at least one homopolyamide prepared via polycondensation of diamines and dicarboxylic acids, wherein the homopolyamide has an enthalpy of fusion of at least 125 J/g and a recrystallization temperature of at least 148° C.
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