发明授权
- 专利标题: MOS varactor structure and methods
- 专利标题(中): MOS变容二极管的结构和方法
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申请号: US13013677申请日: 2011-01-25
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公开(公告)号: US08450827B2公开(公告)日: 2013-05-28
- 发明人: Chi-Feng Huang , Chia-Chung Chen
- 申请人: Chi-Feng Huang , Chia-Chung Chen
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater & Matsil, L.L.P.
- 主分类号: H01L21/36
- IPC分类号: H01L21/36
摘要:
Apparatus and methods for a MOS varactor structure are disclosed An apparatus is provided, comprising an active area defined in a portion of a semiconductor substrate; a doped well region in the active area extending into the semiconductor substrate; at least two gate structures disposed in parallel over the doped well region; source and drain regions disposed in the well region formed on opposing sides of the gate structures; a gate connector formed in a first metal layer overlying the at least two gate structures and electrically coupling the at least two gate structures; source and drain connectors formed in a second metal layer and electrically coupled to the source and drain regions; and interlevel dielectric material separating the source and drain connectors in the second metal layer from the gate connector formed in the first metal layer. Methods for forming the structure are disclosed.
公开/授权文献
- US20120187494A1 MOS Varactor Structure and Methods 公开/授权日:2012-07-26
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