Invention Grant
- Patent Title: Integrated circuit board
- Patent Title (中): 集成电路板
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Application No.: US12847276Application Date: 2010-07-30
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Publication No.: US08451617B2Publication Date: 2013-05-28
- Inventor: Chun-Kong Chan , Chi Ching Chen
- Applicant: Chun-Kong Chan , Chi Ching Chen
- Applicant Address: TW Taipei County
- Assignee: Lien Chang Electronic Enterprise Co., Ltd.
- Current Assignee: Lien Chang Electronic Enterprise Co., Ltd.
- Current Assignee Address: TW Taipei County
- Agency: Rosenberg, Klein & Lee
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/30 ; H05K1/02

Abstract:
An integrated circuit board includes a bridging filtering capacitor, a bypass capacitor, a thermistor, and a varistor. The integrated circuit board further includes an electrolytic capacitor set having a plurality of electrolytic capacitors, which are arranged in parallel and adjacent to each other, and a mounting frame for grouping the electrolytic capacitors. The present invention uses the above elements to reduce the vertical height, the horizontal width, and the occupied area. Therefore, the overall dimension of the circuit board can be reduced to make the electronic devices smaller, especially for thin electronic devices such as LCD TVs and screens.
Public/Granted literature
- US20120026698A1 INTEGRATED CIRCUIT BOARD Public/Granted day:2012-02-02
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