Invention Grant
US08453314B2 Process for forming channels in a flexible circuit substrate using an elongated wedge and a channel shaped receptacle
有权
在柔性电路基板中使用细长楔形物和通道形状的容器形成通道的方法
- Patent Title: Process for forming channels in a flexible circuit substrate using an elongated wedge and a channel shaped receptacle
- Patent Title (中): 在柔性电路基板中使用细长楔形物和通道形状的容器形成通道的方法
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Application No.: US13368248Application Date: 2012-02-07
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Publication No.: US08453314B2Publication Date: 2013-06-04
- Inventor: Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
- Applicant: Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
- Applicant Address: US MA Waltham
- Assignee: Raytheon Company
- Current Assignee: Raytheon Company
- Current Assignee Address: US MA Waltham
- Agency: Christie, Parker & Hale, LLP
- Main IPC: H01P11/00
- IPC: H01P11/00
Abstract:
A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.
Public/Granted literature
- US20120137505A1 PROCESS FOR FABRICATING AN ORIGAMI FORMED ANTENNA RADIATING STRUCTURE Public/Granted day:2012-06-07
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