A system for measuring physical parameters of a tire, according to one embodiment of the present invention comprises a sensor layer and a circuit layer. The sensor layer is communicatively coupled to the circuit layer. The sensor layer is configured as a first thin film and embedded in the tire. The sensor layer provides a signal related to a physical parameter of the tire. The circuit layer is configured as a second thin film and embedded in the tire. The circuit layer processes the signal provided by the sensor layer.