Invention Grant
US08455345B2 Methods of forming gate structure and methods of manufacturing semiconductor device including the same
有权
形成栅极结构的方法和制造包括其的半导体器件的制造方法
- Patent Title: Methods of forming gate structure and methods of manufacturing semiconductor device including the same
- Patent Title (中): 形成栅极结构的方法和制造包括其的半导体器件的制造方法
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Application No.: US13228089Application Date: 2011-09-08
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Publication No.: US08455345B2Publication Date: 2013-06-04
- Inventor: Ha-Jin Lim , Moon-Han Park , Min-Woo Song , Jin-Ho Do , Weon-Hong Kim , Moon-Kyun Song , Dae-Kwon Joo
- Applicant: Ha-Jin Lim , Moon-Han Park , Min-Woo Song , Jin-Ho Do , Weon-Hong Kim , Moon-Kyun Song , Dae-Kwon Joo
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR10-2010-0092394 20100920
- Main IPC: H01L21/28
- IPC: H01L21/28

Abstract:
A method of forming agate structure having an improved electric characteristic is disclosed. A gate insulating layer is formed on a substrate and a metal layer is formed on the gate insulating layer. Then, an amorphous silicon layer is formed on the metal layer by a physical vapor deposition (PVD) process. An impurity doped polysilicon layer is formed on the amorphous silicon layer. Formation of an oxide layer at an interface between the amorphous silicon layer and the metal layer may be prevented.
Public/Granted literature
- US20120070975A1 Methods of Forming Gate Structure and Methods of Manufacturing Semiconductor Device Including the Same Public/Granted day:2012-03-22
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