Invention Grant
- Patent Title: ESD protection device and method for manufacturing the same
- Patent Title (中): ESD保护装置及其制造方法
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Application No.: US13115221Application Date: 2011-05-25
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Publication No.: US08455918B2Publication Date: 2013-06-04
- Inventor: Jun Adachi , Jun Urakawa
- Applicant: Jun Adachi , Jun Urakawa
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-301643 20081126
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
An ESD protection device is manufactured such that its ESD characteristics are easily adjusted and stabilized. The ESD protection device includes an insulating substrate, a cavity provided in the insulating substrate, at least one pair of discharge electrodes each including an exposed portion that is exposed in the cavity, and external electrodes provided on a surface of the insulating substrate and connected to the discharge electrodes. Supporting electrodes obtained by dispersing conductive powder in an insulating material defining the insulating substrate are provided along a bottom surface and a top surface that define the cavity between the exposed portions of the at least one pair of discharge electrodes.
Public/Granted literature
- US20110222203A1 ESD PROTECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2011-09-15
Information query
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