发明授权
- 专利标题： Method for reducing chip warpage
- 专利标题（中）： 降低芯片翘曲的方法
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申请号： US13240540申请日： 2011-09-22
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公开(公告)号： US08455999B2公开(公告)日： 2013-06-04
- 发明人: Ting-Hau Wu , Chun-Ren Cheng , Jiou-Kang Lee , Shang-Ying Tsai , Jung-Huei Peng
- 申请人： Ting-Hau Wu , Chun-Ren Cheng , Jiou-Kang Lee , Shang-Ying Tsai , Jung-Huei Peng
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater & Matsil, L.L.P.
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A method of forming an integrated circuit structure including providing a wafer comprising a front surface and a back surface, wherein the wafer comprises a chip; forming an opening extending from the back surface into the chip; filling an organic material in the opening, wherein substantially no portion of the organic material is outside of the opening and on the back surface of the wafer; and baking the organic material to cause a contraction of the organic material.
公开/授权文献
- US20120007220A1 Method for Reducing Chip Warpage 公开/授权日：2012-01-12
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