发明授权
US08456186B2 Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method
失效
可靠性评估试验装置，可靠性评价试验系统，接触器和可靠性评价试验方法
- 专利标题： Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method
- 专利标题（中）： 可靠性评估试验装置，可靠性评价试验系统，接触器和可靠性评价试验方法
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申请号： US11769432申请日： 2007-06-27
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公开(公告)号： US08456186B2公开(公告)日： 2013-06-04
- 发明人: Kiyoshi Takekoshi , Hisatomi Hosaka , Junichi Hagihara , Kunihiko Hatsushika , Takamasa Usui , Hisashi Kaneko , Nobuo Hayasaka , Yoshiyuki Ido
- 申请人： Kiyoshi Takekoshi , Hisatomi Hosaka , Junichi Hagihara , Kunihiko Hatsushika , Takamasa Usui , Hisashi Kaneko , Nobuo Hayasaka , Yoshiyuki Ido
- 申请人地址： JP Tokyo JP Ogaki-shi
- 专利权人： Tokyo Electron Limited,Ibiden Co., Ltd.
- 当前专利权人： Tokyo Electron Limited,Ibiden Co., Ltd.
- 当前专利权人地址： JP Tokyo JP Ogaki-shi
- 代理机构： Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- 优先权： JP2001-367268 20011130
- 主分类号： G01R31/02
- IPC分类号： G01R31/02 ; G01R31/00
摘要：
A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.