Invention Grant
- Patent Title: Loudspeaker assembly
- Patent Title (中): 扬声器总成
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Application No.: US13049984Application Date: 2011-03-17
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Publication No.: US08457339B2Publication Date: 2013-06-04
- Inventor: Jian-Hui Li
- Applicant: Jian-Hui Li
- Applicant Address: CN Shenzhen HK Kowloon
- Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee: Shenzhen Futaihong Precision Industry Co., Ltd.,FIH (Hong Kong) Limited
- Current Assignee Address: CN Shenzhen HK Kowloon
- Agency: Altis Law Group, Inc.
- Priority: CN201010589743 20101215
- Main IPC: H04R23/00
- IPC: H04R23/00
Abstract:
A loudspeaker assembly includes a first shell, a second shell, and a loudspeaker embedded in the first shell. Together the first shell and the second shell enclose a sound chamber. At least one of the first shell and the second shell can be folded to adjust the size of the sound chamber.
Public/Granted literature
- US20120155686A1 LOUDSPEAKER ASSEMBLY Public/Granted day:2012-06-21
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