发明授权
- 专利标题： Post-CMP wafer cleaning apparatus
- 专利标题（中）： CMP后晶圆清洗装置
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申请号： US13104964申请日： 2011-05-10
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公开(公告)号： US08458842B2公开(公告)日： 2013-06-11
- 发明人: Li-Chung Liu , Yi-Nan Chen , Hsien-Wen Liu
- 申请人： Li-Chung Liu , Yi-Nan Chen , Hsien-Wen Liu
- 申请人地址： TW Kueishan, Tao-Yuan Hsinen
- 专利权人： Nanya Technology Corp.
- 当前专利权人： Nanya Technology Corp.
- 当前专利权人地址： TW Kueishan, Tao-Yuan Hsinen
- 代理商 Winston Hsu; Scott Margo
- 主分类号： B08B3/02
- IPC分类号： B08B3/02
摘要：
A post-CMP wafer cleaning apparatus includes a chamber; a plurality of rollers adapted to hold and rotate a wafer within the chamber; at least one brush adapted to scrub a surface of the wafer to be cleaned; and a liquid spraying device adapted to spray a liquid on the wafer, the liquid spraying device comprising two spray bars jointed together via a joint member.
公开/授权文献
- US20120284936A1 POST-CMP WAFER CLEANING APPARATUS 公开/授权日：2012-11-15