Invention Grant
- Patent Title: Vacuum mold
- Patent Title (中): 真空模具
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Application No.: US13205374Application Date: 2011-08-08
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Publication No.: US08459331B2Publication Date: 2013-06-11
- Inventor: Quoc Tran Pham , Sean Timothy O'Keeffe
- Applicant: Quoc Tran Pham , Sean Timothy O'Keeffe
- Applicant Address: US CA Rancho Santa Margarita
- Assignee: Crucible Intellectual Property, LLC
- Current Assignee: Crucible Intellectual Property, LLC
- Current Assignee Address: US CA Rancho Santa Margarita
- Agency: Pillsbury Winthrop Shaw Pittman LLP
- Main IPC: B22D18/06
- IPC: B22D18/06 ; B22D17/22

Abstract:
Disclosed is a vacuum mold with at least a first plate and a second plate to mold materials (e.g., amorphous alloys), and a method for manufacturing parts using the mold. An ejector mechanism, to eject molded material, is enclosed within an ejector box that is vacuum sealed relative to the plates. An ejector rod for moving the mechanism is also vacuum sealed via a seal in a vacuum feed through opening. Seals are provided between adjacent interfaces of the mold parts (plates and ejector box) to vacuum seal the mold. The mold is connected to at least one vacuum source that applies vacuum pressure thereto via a first vacuum port in a first direction. A second vacuum port may also be provided to apply pressure in a second direction. A vacuum release valve may be connected to the mold to release vacuum pressure applied to the mold.
Public/Granted literature
- US20130037232A1 VACUUM MOLD Public/Granted day:2013-02-14
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