Invention Grant
- Patent Title: Terminal block and method of manufacturing it
- Patent Title (中): 接线端子及其制造方法
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Application No.: US13293240Application Date: 2011-11-10
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Publication No.: US08460039B2Publication Date: 2013-06-11
- Inventor: Daisuke Akuta
- Applicant: Daisuke Akuta
- Applicant Address: JP
- Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee: Sumitomo Wiring Systems, Ltd.
- Current Assignee Address: JP
- Agent Gerald E. Hespos; Michael J. Porco; Matthew T. Hespos
- Priority: JP2011-010058 20110120
- Main IPC: H01R9/22
- IPC: H01R9/22

Abstract:
A terminal block has nuts (10), each with a step (12) slightly recessed and formed at an outer peripheral part of an upper fastening surface (10A) on which conductors are to be placed. A heat sink (40) is arranged below the nuts (10) and an insulating plate (20) is sandwiched between the nuts (10) and the heat sink (40). Resin (60) is molded around these three kinds of members (10, 20, 40). The steps (12) are pressed by resin cut-off parts (73) provided in a first mold (71) for the resin (60). Restricted surfaces (12A) at outer peripheral sides of press surfaces (12B) to be pressed by the resin cut-off parts (73) on the steps (12) are covered by the molded resin (60).
Public/Granted literature
- US20120190251A1 TERMINAL BLOCK, METHOD OF MANUFACTURING IT AND NUT Public/Granted day:2012-07-26
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