Invention Grant
- Patent Title: Method and apparatus for detecting defects
- Patent Title (中): 检测缺陷的方法和装置
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Application No.: US13362808Application Date: 2012-01-31
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Publication No.: US08462330B2Publication Date: 2013-06-11
- Inventor: Hiroyuki Nakano , Toshihiko Nakata , Sachio Uto , Akira Hamamatsu , Shunji Maeda , Yuta Urano
- Applicant: Hiroyuki Nakano , Toshihiko Nakata , Sachio Uto , Akira Hamamatsu , Shunji Maeda , Yuta Urano
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Antonelli, Terry, Stout & Kraus, LLP.
- Priority: JP2005-181400 20050622; JP2006-049488 20060227
- Main IPC: G01N21/88
- IPC: G01N21/88

Abstract:
A method and apparatus for detecting defects are provided for detecting defects or foreign matter on an object to be inspected. The apparatus includes a movable stage for mounting a specimen, an illumination system for irradiating a circuit pattern with light from an inclined direction, and an image-forming optical system for forming an image of an irradiated detection area on a detector from the upward and oblique directions. With this arrangement, diffracted light and scattered light caused on the circuit pattern through the illumination by the illumination system is collected. A spatial filter is provided on a Fourier transform surface for blocking the diffracted light from a linear part of the circuit pattern. The scattered and reflected light received by the detector is converted into an electrical signal. The converted electrical signal of one chip is compared with that of the other adjacent chip.
Public/Granted literature
- US20120194809A1 METHOD AND APPARATUS FOR DETECTING DEFECTS Public/Granted day:2012-08-02
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