Invention Grant
- Patent Title: Electronic device having heat dissipation airflow path
- Patent Title (中): 具有散热气流路径的电子设备
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Application No.: US13095942Application Date: 2011-04-28
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Publication No.: US08462500B2Publication Date: 2013-06-11
- Inventor: Ji-Feng Qiu , Hong Li , Xiao-Hui Zhou , Rui Li
- Applicant: Ji-Feng Qiu , Hong Li , Xiao-Hui Zhou , Rui Li
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201010609861 20101228
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
An exemplary electronic device includes a cover, a circuit board and a driving module both mounted on the bottom cover, an electronic component fixed on the circuit board, and a top cover covering the bottom cover. The driving module has a rotating shaft adapted for supportively driving an optical disk to rotate. The electronic component generates heat during operation. Through holes are defined in the top cover and located at a periphery of the rotating shaft. When the optical disk is mounted on the rotating shaft and driven to rotate by the rotating shaft, air heated by the electronic component in the electronic device can flow out of the top cover via the through holes, and rotation of the optical disk facilitates such airflow.
Public/Granted literature
- US20120162911A1 ELECTRONIC DEVICE HAVING HEAT DISSIPATION AIRFLOW PATH Public/Granted day:2012-06-28
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